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Product

Large

리사이징 KL.png

SQ3000K-L

적용분야

  • SMT Component Placement, Solder Quality, Special Components (Fine-pitch IC, BGA, etc.)
  • THT Insertion Status, Soldering Quality, Large Components
  • Semiconductor Advanced Packaging, Bump, Die, Bonding Quality

상세정보

상세정보
Inspection Speed 20~40㎠/Sec(2D+3D)
Min. Component 0402㎜(01005in.)
Panel Size 1,000 x 650mm
Image Resolution 7.2㎛ / 9.9㎛
Body Dimension 1,650 x 1,600 x1600㎜ (W×D×H)
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