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Product

Standard

SQ3000K_좌측(배경제거) 수정.png

SQ3000K-S

적용분야

  • SMT Component Placement, Solder Quality, Special Components(Fine-pitch IC, BGA, etc.)
  • THT Insertion Status, Soldering Quality, Large Components
  • Semiconductor Advanced Packaging, Bump, Die, Bonding Quality

상세정보

상세정보
Inspection Speed 20~40㎠/Sec(2D+3D)
Min. Component 0402㎜(01005in.)
Panel Size 450㎜ × 450㎜
Image Resolution 7.2㎛ / 9.9㎛
Body Dimension 1,135 × 1,430 × 1,520㎜ (W×D×H)
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